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器件3D模型￥ 1.005
AT24C01D-XHM-T 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
存储芯片
封装:
TSSOP-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P5P6Hot
原理图在P8
封装尺寸在P26P40P43
型号编码规则在P26
标记信息在P26
封装信息在P26P27P28P29P30P31P32P33P34P35P36P37
技术参数、封装参数在P9P12
电气规格在P9P10P11P12P13
型号编号列表在P43
导航目录
AT24C01D-XHM-T数据手册
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AT24C01D/AT24C02D
I²C-Compatible (Two-Wire) Serial EEPROM
1‑Kbit (128 x 8), 2‑Kbit (256 x 8)
Features
• Low-Voltage Operation:
– V
CC
= 1.7V to 3.6V
• Internally Organized as 128 x 8 (1K) or 256 x 8 (2K)
• Industrial Temperature Range: -40°C to +85°C
• I
2
C-Compatible (Two-Wire) Serial Interface:
– 100 kHz Standard mode, 1.7V to 3.6V
– 400 kHz Fast mode, 1.7V to 3.6V
– 1 MHz Fast Mode Plus (FM+), 2.5V to 3.6V
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• Write-Protect Pin for Full Array Hardware Data Protection
• Ultra Low Active Current (1 mA maximum) and Standby Current (0.8 μA maximum)
• 8-Byte Page Write Mode:
– Partial page writes allowed
• Random and Sequential Read Modes
• Self-Timed Write Cycle within 5 ms Maximum
• ESD Protection > 4,000V
• High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
• Green Package Options (Lead-free/Halide-free/RoHS compliant)
• Die Sale Options: Wafer Form and Bumped Wafers
Packages
• 8-Lead PDIP
(1)
, 8-Lead SOIC, 5-Lead SOT23, 8-Lead TSSOP, 8-Pad UDFN and 8-Ball VFBGA
Note:
1. Contact Microchip Sales for the availability of this package.
© 2018 Microchip Technology Inc.
Datasheet
DS20006100A-page 1
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