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LM4140ACM-2.5/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电压基准芯片
封装:
SOIC-8
描述:
串联电压参考，固定，2.5V 至 3.3V### 电压参考，Texas Instruments精密固定和可调电压参考 IC 利用串联、并联或串联/并联拓扑，并提供通孔和表面安装封装。 电压参考的初始准确度为 ±0.02 至 ±2%。
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引脚图在P3Hot
典型应用电路图在P14
原理图在P8
封装尺寸在P1P22P24P25
标记信息在P22P23
封装信息在P22P23P24P25
技术参数、封装参数在P4
电气规格在P5P11P12P15P19
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LM4140ACM-2.5/NOPB数据手册
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4
LM22675
,
LM22675-Q1
ZHCS544L –SEPTEMBER 2008–REVISED NOVEMBER 2014
www.ti.com.cn
Copyright © 2008–2014, Texas Instruments Incorporated
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The absolute-maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a
pulse of up to 50 ns.
6 Specifications
6.1 Absolute Maximum Ratings
(1)(2)
MIN MAX UNIT
VIN to GND 43 V
EN Pin Voltage –0.5 6 V
SW to GND
(3)
–5 V
IN
V
BOOT Pin Voltage V
SW
+ 7 V
FB Pin Voltage –0.5 7 V
Power Dissipation Internally Limited
Junction Temperature 150 °C
For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549).
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 Handling Ratings: LM22675
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins
(1)
–2 2 kV
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Handling Ratings: LM22675-Q1
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
V
(ESD)
Electrostatic discharge Human body model (HBM), per AEC Q100-002
(1)
–2 2 kV
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IN
Supply Voltage 4.5 42 V
Junction Temperature Range –40 125 °C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The value of R
θJA
for the SO PowerPAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper.
The R
θJA
value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.
6.5 Thermal Information
THERMAL METRIC
(1)(2)
LM22675,
LM22675-Q1
UNIT
DDA
8 PINS
R
θJA
Junction-to-ambient thermal resistance 60 °C/W
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