Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6748BZCEA3 数据手册 > TMS320C6748BZCEA3 产品修订记录 6/7 页
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TMS320C6748BZCEA3 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
NFBGA-361
描述:
TMS320C6748定点和浮点DSP TMS320C6748 Fixed- and Floating-Point DSP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1
导航目录
TMS320C6748BZCEA3数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20140130001B
Additional Tests
MQ
Manufacturability
(Assembly)
(per mfg. Site
specification)
1 / Pass
-
-
MQ
Manufacturability
(Auto Assembly)
(per automotive
requirements)
-
1 / Pass
-
A1 (PC): Preconditioning:
Performed for THB, Biased HAST, AC, uHAST & TC samples, as applicable.
Ambient Operating Temperature by Automotive Grade Level:
Grade 0 (or A): -40°C to +150°C
Grade 1 (or Q): -40°C to +125°C
Grade 2 (or T): -40°C to +105°C
Grade 3 (or I) : -40°C to +85°C
Grade 4 (or C): -40°C to +70°C
E1 (TEST): Electrical test temperatures of Qual samples (High temperature according to Grade level):
Room/Hot/Cold : HTOL
Room/Hot : THB / HAST, TC / PTC, HTSL, ELFR, ESD & LU
Room : AC/uHAST
Green/Pb-free Status:
Qualified Pb-Free(SMT) and Green
Qualification Data
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Qual Vehicle 1: AM3517ZCN (MSL 3-260C)
Package Construction Details
Assembly Site:
TI-PHI
Mold Compound:
4205283
# Pins-Designator, Family:
491-ZCN, BGA
Mount Compound:
4205412
Solder Ball composition
SnAgCu
Bond Wire:
0.80Mil Au/Cu
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
Lot#1
Lot#2
Lot#3
** Biased HAST
130C/85%RH (264 HRS)
77/0
77/0
77/0
**Unbiased HAST
130C/85%RH (192 HRS)
77/0
77/0
77/0
**T/C
-55C/+125C (1000 Cyc)
77/0
77/0
77/0
**High Temp Storage Bake
150C (1000 Hrs)
20/0
20/0
20/0
ESD CDM
+/- 250V
3/0
3/0
3/0
Manufacturability
(per mfg. Site specification)
Pass
-
-
Notes **- Preconditioning sequence: Level 3-260C.
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