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TPD1E01B04DPLT 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
二极管
封装:
XFDFN-2
描述:
TEXAS INSTRUMENTS TPD1E01B04DPLT 静电保护装置, Bidirectional, 15 V, X2SON, 2 引脚, 3.6 V 新
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3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P1P11P12
原理图在P9P11
封装尺寸在P16P18P19
标记信息在P16
封装信息在P15P16P17P18P19
技术参数、封装参数在P4
应用领域在P1P23
电气规格在P5
导航目录
TPD1E01B04DPLT数据手册
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4
TPD1E01B04
SLVSDG3C –MARCH 2016–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: TPD1E01B04
Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Electrical fast transient IEC 61000-4-5 (5/50 ns) 80 A
Peak pulse
IEC 61000-4-5 power (t
p
- 8/20 µs) 27 W
IEC 61000-4-5 current (t
p
- 8/20 µs) 2.5 A
T
A
Operating free-air temperature –40 125 °C
T
stg
Storage temperature –65 155 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±1000
6.3 ESD Ratings—IEC Specification
VALUE UNIT
V
(ESD)
Electrostatic discharge
IEC 61000-4-2 contact discharge ±15000
V
IEC 61000-4-2 air-gap discharge ±17000
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
IO
Input pin voltage –3.6 3.6 V
T
A
Operating free-air temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information
THERMAL METRIC
(1)
TPD1E01B04
UNITDPL (X2SON)
DPY
(X1SON)
2 PINS 2 PINS
R
θJA
Junction-to-ambient thermal resistance 582 442.6 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 264.5 243.8 °C/W
R
θJB
Junction-to-board thermal resistance 394.4 162.5 °C/W
ψ
JT
Junction-to-top characterization parameter 36.4 154.1 °C/W
ψ
JB
Junction-to-board characterization parameter 394.4 163.0 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance n/a n/a °C/W
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