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AM26LS31INSR 开发手册 - TI（德州仪器）
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TI（德州仪器）
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接口芯片
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SOP-16
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四路差分线路驱动器 16-SO -40 to 85
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AM26LS31INSR数据手册
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Application Report
SCEA041 – September 2008
Wave Solder Exposure of SMT Packages
James Huckabee, Steven Kummerl, Dominic Nguyen, Douglas W. Romm, and Larry Ting ..............................
ABSTRACT
Attaching surface mount components to the bottomside of a printed circuit board (PCB)
by wave solder processing is common practice. Because surface mount components
are normally soldered using a reflow oven process the impact of wave soldering and
wave solder simulation methods must be understood.
Process characterization was performed to compare the wave solder reflow method,
the solder dip method, and standard reflow oven processing. Units processed through
the solder dip method see a very quick rise time to peak temperature which is quite
different from the other two methods. The solder dip method has excessive thermal
shock.
A designed experiment compared the contribution of moisture soak, wave time, and
PCB design. Both moisture soak and wave time have a strong effect on the variation
seen in delamination. Reliability stressing demonstrated passing results for the units.
Testing demonstrated that the solder dip method is not a good simulation method for
wave solder exposure of surface mount components. DOE testing demonstrated that
moisture soak and wave time are significant factors in the process. Reliability stressing
showed that units passed even with variations seen in package delamination.
Contents
1 Introduction .......................................................................................... 2
2 Process Characterization .......................................................................... 3
3 Designed Experiment .............................................................................. 4
4 Summary/Conclusions ............................................................................. 7
5 References .......................................................................................... 7
List of Figures
1 Comparison of Time/Temperature Profiles for Three Soldering Methods................... 3
2 Isometric View of SOIC Gull-Wing Package .................................................... 3
3 Effects Plots ......................................................................................... 6
List of Tables
1 Wave Solder Simulation Conditions in JESD22A111 .......................................... 2
2 Test Results ......................................................................................... 4
3 Experiment Factors ................................................................................. 4
4 Experimental Layout ............................................................................... 5
5 Average Effects ..................................................................................... 5
6 ANOVA Results ..................................................................................... 6
7 Reliability Assessment Results ................................................................... 7
8 Summary of Test Results .......................................................................... 7
SCEA041 – September 2008 Wave Solder Exposure of SMT Packages 1
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