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PIC16C55-RC/P 开发手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
PDIP-28
描述:
PIC16C5x 8 位微控制器Microchip 的 PIC16C 系列微控制器 8 位 CMOS MCU，将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中，从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 现在由基于闪存的型号代替，这些设备在传统设计方面也仍受到欢迎。 对于新应用，应考虑 PIC16F 型号。 PIC16C5x 系列微控制器基于 Microchip 基线体系结构，带 2 层硬件堆栈和 33 个 12 位指令。 这些 MCU 提供高达 10 MIPS、3 字节程序内存和高达 73 字节 RAM 的数据存储器。 板载是一个 RC 振荡器，精确度为 ±1%。### 特点33 个指令 2 级硬件堆栈 除 PIC16C55/C55A/C57/C57C/CR57C 之外的所有型号上均有 12 个输入/输出引脚 20 个输入/输出引脚 – PIC16C55/C55A/C57/C57C/CR57C 一个 8 位计时器 监控计时器 (WDT) 通电重置 (POR) 设备重置计时器 (DRT) ### PIC16 微控制器
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Product Change Notification - JAON-13OEWI224 (Printer Friendly)
Date: 13 Jan 2016
Notification subject: CCB 1839 Initial Notice: Qualification of CuPdAu wire in selected products of the 40K, 57K, 90K, 120K, 150K, 160K and 200K wafer
technologies available in 28L and 40L PDIP (600 mils) package at MMT.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K, 57K, 90K, 120K,
150K, 160K and 200K wafer technologies available in 28L and 40L PDIP (600 mils) package at MMT assembly site.
Pre Change:
Gold (Au) or Palladium coated copper wire (PdCu) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT assembly site MMT assembly site
Wire material Au wire or PdCu wire CuPdAu wire
Die attach material CRM-1064L CRM-1064L
Molding compound material GE800 GE800
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability by qualifying Palladium coated copper with gold flash (CuPdAu) bond wire.
Change Implementation Status:
In Progress
Estimated First Ship Date:
April 20, 2016 (date code: 1616)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Summary Table:
January 2016 February 2016 March 2016 April 2016
WW 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17
Initial PCN Issue
Date
X
Qual Report
Availability
X
Final PCN Issue
Date
X
Implementation
Date
X
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
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Product Change Notification
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JAON
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13OEWI224
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13 Jan 2016
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CCB 1839 Initial Noti
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2016
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON
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13OEWI224
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