Datasheet 搜索 > 射频接收器 > TI（德州仪器） > CC2564MODACMOG 数据手册 > CC2564MODACMOG 数据手册 1/66 页
￥ 94.026
CC2564MODACMOG 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
射频接收器
封装:
SMD-33
描述:
具有基本速率、增强数据速率和带集成天线的低功耗模块的 Bluetooth® 4.1 35-QFM -30 to 85
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P3P19P31P32
封装尺寸在P50P54
焊盘布局在P51P55
型号编码规则在P57
标记信息在P57P58
封装信息在P46P49P53P57P58P59P60P61P62P63P64P65
焊接温度在P42
技术参数、封装参数在P8P9P10P11P12P13P14P15P16P17P18P22
应用领域在P2P31P32P33P34P35P36P37P38P39P40P41
电气规格在P10
导航目录
CC2564MODACMOG数据手册
Page:
of 66 Go
若手册格式错乱，请下载阅览PDF原文件
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC2564MODN, CC2564MODA
SWRS160E –FEBRUARY 2014–REVISED JANUARY 2017
CC2564MODx Bluetooth
®
Host Controller Interface (HCI) Module
1 Device Overview
1
1.1 Features
1
• Module Solution Based on TI's CC2564B Dual-
Mode Bluetooth
®
, Available in Two Variants:
– CC2564MODA With Integrated Antenna
– CC2564MODN With External Antenna
• Fully Certified Module for FCC, IC, CE, and
Bluetooth 4.1
– FCC (Z64-2564N), IC (451I-2564N) Modular
Grant (see Section 6.2.1.3, Section 7.1.1, and
Section 7.1.2)
– CE Certified as Summarized in the Declaration
of Conformity (see Section 7.1.3)
– Bluetooth 4.1 Controller Subsystem Qualified
(CC2564MODN: QDID 55257; CC2564MODA:
QDID 64631). Compliant up to the HCI Layer
• Highly Optimized for Design Into Small Form
Factor Systems and Flexibility:
– CC2564MODA
– Integrated Chip Antenna
– Module Footprint: 35 Terminals, 0.8-mm
Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
– CC2564MODN
– Single-Ended 50-Ω RF Interface
– Module Footprint: 33 Terminals, 0.8-mm
Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, µ-Law,
and Transparent (Uncoded)
– Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• Low Energy Features Include:
– Support of up to 10 Simultaneous Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
• Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1.5 TX Power up to +10 dBm
– –93 dbm Typical RX Sensitivity
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Provides Longer Range, Including Twice the
Range of Other Low-Energy-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
– UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
– Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
• CC256x Bluetooth Hardware Evaluation Tool:
PC-Based Application to Evaluate RF Performance
of the Device and Configure Service Pack
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
