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MC3487D
器件3D模型
2.821
MC3487D数据手册
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Heatsinks for SMD
particularly suitable for SMD components
low profile
reduced weight
effective heat dissipation
can be glued directly onto the component
soudable versions
customer specific versions on request
special packaging like tape and real, bar magazin, tary etc. on request
[mm]R
th
[K/W]art. no.
5123ICK SMD A 5 ...
887ICK SMD A 8 ...
1075ICK SMD A 10 ...
1363ICK SMD A 13 ...
1751ICK SMD A 17 ...
2234ICK SMD A 22 ...
[mm]R
th
[K/W]art. no.
556ICK SMD B 5 ...
747ICK SMD B 7 ...
1035ICK SMD B 10 ...
1329ICK SMD B 13 ...
1922ICK SMD B 19 ...
please indicate: surface treatment...
black anodised=SA
solderable surface=MI
H
HHH
A 89
Profiles for PCB componentsE 9 10
Aluminium oxide wafers
B 25
A 87
Heatsinks for PCBE 11
Mica wafers
B 25 27
SMD-heatsinksE 8
Kapton insulator washers
A 87 108
Profiles for PCB mountingE 35
Insulting clamping parts
H
Hola1
H
Heatsinks for DIL-IC, PLCC and SMD
H
A
B
C
D
E
F
G
H
I
K
L
M
N

MC3487D 数据手册

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1 页 / 0.71 MByte
TI(德州仪器)
8 页 / 0.11 MByte
TI(德州仪器)
1 页 / 0.13 MByte

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