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MCP4131-502E/MF
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MCP4131-502E/MF数据手册
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© 2008 Microchip Technology Inc. DS22060B-page 31
MCP413X/415X/423X/425X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Ta ble 3 -1.
Additional descriptions of the device pins follows.
TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP413X/415X/423X/425X
Pin
Weak
Pull-up/
down
(2)
Standard Function
Single Dual
Symbol I/O
Buffer
Type
Rheo Pot
(1)
Rheo Pot
8L 8L 10L 14L 16L
111116CS
I HV w/ST “smart” SPI Chip Select Input
2 2 2 2 1 SCK I HV w/ST “smart” SPI Clock Input
3 3 3 2 SDI I HV w/ST “smart” SPI Serial Data Input
3 SDI/SDO I/O HV w/ST “smart” SPI Serial Data Input/Output
(Note 1, Note 3)
44443, 4V
SS
P Ground
5 5 5 P1B A Analog No Potentiometer 1 Terminal B
6 6 6 P1W A Analog No Potentiometer 1 Wiper Terminal
7 7 P1A A Analog No Potentiometer 1 Terminal A
5 8 8 P0A A Analog No Potentiometer 0 Terminal A
5 6 7 9 9 P0W A Analog No Potentiometer 0 Wiper Terminal
6 7 8 10 10 P0B A Analog No Potentiometer 0 Terminal B
12 13 SHDN
I HV w/ST “smart” Hardware Shutdown
7 9 13 14 SDO O O No SPI Serial Data Out
8 8 10 14 15 V
DD
P Positive Power Supply Input
11 11,12 NC No Connection
9 9 11 17 EP Exposed Pad (Note 4)
Legend: HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals) I = digital input (high Z)
O = digital output I/O = Input / Output
P = Power
Note 1: The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
2: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and
shutdown current.
3: The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
4: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s V
SS
pin.

MCP4131-502E/MF 数据手册

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