Datasheet 搜索 > RAM芯片 > Micron（镁光） > MT48LC2M32B2P-55:G 数据手册 > MT48LC2M32B2P-55:G 数据手册 12/80 页
器件3D模型￥ 1.881
MT48LC2M32B2P-55:G 数据手册 - Micron（镁光）
制造商:
Micron（镁光）
分类:
RAM芯片
封装:
TSOP-86
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P8
封装尺寸在P12P13
型号编码规则在P2
标记信息在P1
功能描述在P7P24
技术参数、封装参数在P17P18P19P20P21P22P23
应用领域在P14P15
电气规格在P17P18P19P20P21P22P23
型号编号列表在P2
导航目录
MT48LC2M32B2P-55:G数据手册
Page:
of 80 Go
若手册格式错乱，请下载阅览PDF原文件
Package Dimensions
Figure 4: 86-Pin Plastic TSOP II (400 mil) – Package Codes TG/P
See Detail A
2X R 1.00
2X R 0.75
0.50
TYP
0.61
10.16 ±0.08
0.50 ±0.10
11.76 ±0.20
Pin #1 ID
Detail A
22.22 ±0.08
0.20
+0.07
-0.03
0.15
+0.03
-0.02
0.10
+0.10
-0.05
1.20 MAX
0.10
0.25
Gage
plane
0.80
TYP
2X 0.10
2X 2.80
Plastic package material: Epoxy novolac
Plated lead finish:
TG (90% Sn, 10% Pb) or P (100% Sn) 0.01 ±0.005 thick per side
Package width and length do not include
mold protrusion. Allowable protrusion is
0.25 per side.
Notes:
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
3. "2X" means the notch is present in two locations (both ends of the device).
4. Package may or may not be assembled with a location notch.
64Mb: x32 SDRAM
Package Dimensions
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. V 09/14 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
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