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NC7WZ16L6X 数据手册 - ON Semiconductor(安森美)
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ON Semiconductor(安森美)
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缓冲器
封装:
UFDFN-6
描述:
ON Semiconductor TinyLogic UHS 系列 双 单端 非反相 缓冲器 NC7WZ16L6X, 6引脚 MicroPak封装 No
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NC7WZ16L6X数据手册
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© 1999 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7WZ16 • Rev. 1.0.4 8
NC7WZ16 — TinyLogic
®
UHS Dual Buffer
Physical Dimensions
1.00
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
NOTES:
A. COMPLIES TO JEDEC MO-252 STANDARD
0.05 C
A
B
0.55MAX
0.05 C
C
0.35
0.09
0.19
123
0.35
0.25
5X
6X
DETAIL A
0.60
(0.08)
4X
(0.05) 6X
0.40
0.30
0.075X45°
CHAMFER
5X 0.40
0.35
1X 0.45
6X 0.19
TOP VIEW
BOTTOM VIEW
0.66
0.10 CBA
.05 C
0.89
PIN 1
0.05
C
2X
2X
1.00
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC
E. DRAWING FILENAME AND REVISION: MGF06AREV3
0.52
0.73
0.57
0.20 6X
1X
5X
RECOMMENDED LAND PATTERN
FOR SPACE CONSTRAINED PCB
DETAIL A
PIN 1 LEAD SCALE: 2X
ALTERNATIVE LAND PATTERN
FOR UNIVERSAL APPLICATION
DESIGN.
0.90
MIN 250uM
654
0.35
(0.08) 4X
SIDE VIEW
Figure 10. 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/MicroPAK2_6L_tr.pdf
.
Package Designator Tape Section Cavity Number Cavity Status Cover Type Status
FHX
Leader (Start End) 125 (Typical) Empty Sealed
Carrier 5000 Filled Sealed
Trailer (Hub End) 75 (Typical) Empty Sealed
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