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STM32F071CB STM32F071RB STM32F071VB STM32F071V8 Electrical characteristics
96
Figure 25. ADC accuracy characteristics
Figure 26. Typical connection diagram using the ADC
1. Refer to Table 56: ADC characteristics for the values of R
AIN
, R
ADC
and C
ADC
.
2. C
parasitic
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high C
parasitic
value will downgrade conversion accuracy. To remedy
this, f
ADC
should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 12: Power supply
scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as
close as possible to the chip.
2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-robust) analog input
pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog
input. It is recommended to add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative current.
Any positive injection current within the limits specified for I
INJ(PIN)
and ΣI
INJ(PIN)
in Section 6.3.14 does not affect the ADC
accuracy.
3. Better performance may be achieved in restricted V
DDA
, frequency and temperature ranges.
4. Data based on characterization results, not tested in production.
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