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STM32F091VCT6U 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-100
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STM32F091VCT6U数据手册
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DocID026284 Rev 3 121/127
STM32F091xB STM32F091xC Package information
124
7.8 Thermal characteristics
The maximum chip junction temperature (T
J
max) must never exceed the values given in
Table 24: General operating conditions.
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max x Θ
JA
)
Where:
• T
A
max is the maximum ambient temperature in °C,
•Θ
JA
is the package junction-to-ambient thermal resistance, in ° C/W,
• P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
• P
INT
max is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max = Σ (V
OL
× I
OL
) + Σ ((V
DDIOx
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
7.8.1 Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
7.8.2 Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in
Section 8: Part numbering.
Table 80. Package thermal characteristics
Symbol Parameter Value Unit
Θ
JA
Thermal resistance junction-ambient
UFBGA100 - 7 × 7 mm
55
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm
42
Thermal resistance junction-ambient
UFBGA64 - 5 × 5 mm / 0.5 mm pitch
65
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
44
Thermal resistance junction-ambient
WLCSP64 - 0.4 mm pitch
53
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
54
Thermal resistance junction-ambient
UFQFPN48 - 7 × 7 mm
32
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