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STM32F103VEH7 数据手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
BGA-100
描述:
STMICROELECTRONICS STM32F103VEH7 微控制器, 32位, 电机控制, ARM 皮质-M3, 72 MHz, 512 KB, 64 KB, 100 引脚, BGA
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P25P26P27P28P29P30P31P32P33P34P35P36Hot
典型应用电路图在P60P62P110
封装尺寸在P115P116P117P118P119P120P121P122P123P124P125P126
型号编码规则在P134P135P136
技术参数、封装参数在P22P43P88
电气规格在P41P42P43P44P45P46P47P48P49P50P51P52
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STM32F103VEH7数据手册
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STM32F103xC, STM32F103xD, STM32F103xE Package information
136
Figure 66. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package recommended footprintoutline
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 68. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.500 mm
Dsm
0.570 mm typ. (depends on the soldermask reg-
istration tolerance)
Stencil opening 0.500 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
Table 67. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
+B)3B9
'SDG
'VP
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