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器件3D模型￥ 32.53
STM32F373V8H6 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
BGA-100
描述:
STMICROELECTRONICS STM32F373V8H6 微控制器, 32位, 16Σ-Δ模数转换器, ARM 皮质-M4F, 72 MHz, 64 KB, 16 KB, 100 引脚, BGA
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P29P30P31P32P33P34P35P36P37P38P39P40Hot
典型应用电路图在P75P77P100
原理图在P12
封装尺寸在P115P116P117P118P119P120P121P122P123P124P125P126
型号编码规则在P128P129P130
标记信息在P117
技术参数、封装参数在P55
电气规格在P52P53P54P55P56P57P58P59P60P61P62P63
型号编号列表在P1
导航目录
STM32F373V8H6数据手册
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DocID022691 Rev 6 115/136
STM32F373xx Package information
130
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
7.1 UFBGA100 package information
Figure 34. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch,
ultra fine pitch ball grid array package outline
1. Drawing is not to scale.
Table 76. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data
Symbol
millimeters inches
(1)
Min. Typ. Max. Min. Typ. Max.
A 0.460 0.530 0.600 0.0181 0.0209 0.0236
A1 0.050 0.080 0.110 0.0020 0.0031 0.0043
A2 0.400 0.450 0.500 0.0157 0.0177 0.0197
A3 - 0.130 - - 0.0051 -
A4 0.270 0.320 0.370 0.0106 0.0126 0.0146
b 0.200 0.250 0.300 0.0079 0.0098 0.0118
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