Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32F767BGT6 数据手册 > STM32F767BGT6 数据手册 228/255 页
器件3D模型￥ 11.274
STM32F767BGT6 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-208
描述:
STM32F767BGT6 托盘
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P54P55P56P57P58P59P60P61P62P63P64P65Hot
典型应用电路图在P143P144P173
封装尺寸在P225P226P227P228P229P230P231P232P233P234P235P236
型号编码规则在P35P252
技术参数、封装参数在P114P160
电气规格在P111P112P113P114P115P116P117P118P119P120P121P122
导航目录
STM32F767BGT6数据手册
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Package information STM32F765xx STM32F767xx STM32F768Ax STM32F769xx
228/255 DocID029041 Rev 4
LQFP100 device making
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
Figure 85. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package
top view example
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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