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TMP302DDRLR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
SOT-553-6
描述:
在微封装易于使用低功耗低供应温度开关 Easy-to-Use Low-Power Low-Supply TEMPERATURE SWITCH in MicroPackage
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P10P11P12
原理图在P8P10P11
封装尺寸在P15P17P18P19
标记信息在P15P16
封装信息在P14P15P16P17P18P19
技术参数、封装参数在P4
应用领域在P1
电气规格在P5
导航目录
TMP302DDRLR数据手册
Page:
of 22 Go
若手册格式错乱，请下载阅览PDF原文件
TRIPSET0 TRIPSET1
GND
OUT
V
S
HYSTSET
Heat Source
0.1 µF
VIA to Power Ground Plane
Ground Plane for
Thermal
Coupling to Heat
Source
Supply Voltage
Output
10 k
TMP302
www.ti.com
SBOS488C –JUNE 2009–REVISED AUGUST 2015
9 Power Supply Recommendations
The TMP302 family of devices is designed to operate from a single power supply within the range 1.4 and 3.6 V.
No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302
family of devices is fully functional within 35 ms of the voltage at the V
S
pin reaching or exceeding 1.4 V.
10 Layout
10.1 Layout Guidelines
Place the power supply bypass capacitor as close as possible to the V
S
and GND pins. The recommended value
for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or high-
impedance power supplies. Place a 10-kΩ pullup resistor from the open drain OUT pin to the power supply pin
V
S
.
10.2 Layout Example
Figure 14. PCB Layout Example
Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TMP302
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