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AD8436JCPZ-R7 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
封装:
LFCSP-20
描述:
ANALOG DEVICES AD8436JCPZ-R7 转换器, RMS至DC, 低功率, 0.5 %, 1 MHz, 0 °C, 70 °C, LFCSP, 20 引脚
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AD8436JCPZ-R7数据手册
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Product/Process Change Notice - PCN 16_0230 Rev. B
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the
last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of
publication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Assembly Transfer of Select LFCSP Products to ASE Korea
Publication Date: 03-Apr-2017
Effectivity Date: 03-Apr-2017 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Updated POD due to CP-24-14 description revision.
Description Of Change
ADI is transferring to subcontractor ASE Korea for assembly manufacturing of select LFCSP products.
The package outline dimensions, wire diameter of each product will be maintained.
ADI has qualified ASE Korea’s BOM (Bill of Materials). The mold compound is changing from Sumitomo G770 to Sumitomo
G700. Die attach epoxy is changing from Able8290 and Able3230 to EN4900GC for 5x5 LFCSP devices. See BOM attachment for details.
The package outline exposed pad dimensions are changing for 3x3mm 8LD/16LD, 4x4mm 16LD/20LD/24LD, 5x5mm 32LD. See POD
attachment for details.
Reason For Change
ADI's current Assembly supplier STATS ChipPAC China is relocating their factory by end of September 2017.
In this regard, the affected products currently assembled in that facility will be transferred to ASE Korea to ensure continuous supply of
products.
ADI's assembly subcontractors manufacture products using Analog Devices specified manufacturing flows, materials,
process controls and monitors, ensuring the same level of quality and reliability on products they receive from
the new site.
Impact of the change (positive or negative) on fit, form, function & reliability
There will be no impact on the form, fit, function and reliability of the devices.
Product Identification (this section will describe how to identify the changed material)
The parts that will be assembled from the transfer will be identified by assembly lot and the country of origin.
Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Qualification Results
Summary.
Comments
During transition to the new assembly site, products will be Assembled from the either current or the new assembly site. The customers may
receive products that are assembled at SCC or assembled at AEK.
This notification applies to all packing/reel options.
Analog Devices, Inc. PCN 16_0230_Rev_B Page 1 of 4
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