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ADA4528-1ACPZ-R7
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ADA4528-1ACPZ-R7数据手册
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Product/Process Change Notice - PCN 16_0234 Rev. B
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the
last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of
publication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Assembly Transfer to ASE Korea and Test Transfer to STATS ChipPAC Singapore of
Select LFCSP Parts.
Publication Date: 06-Feb-2017
Effectivity Date: 06-Feb-2017 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Added CP-24-15 to POD attachment.
Description Of Change
ADI is transferring to subcontractor ASE Korea for assembly manufacturing and STATS ChipPAC Singapore for test manufacturing of select
LFCSP products.
ADI has qualified ASE Korea's BOM(Bill of Materials). The mold compound is changing from Sumitomo G770 to Sumitomo G700. Die attach
epoxy is changing from Able8290 and Able3230 to EN4900GC for 5x5 LFCSP devices. See BOM attachment for details.
The package outline exposed pad dimensions are changing for 3x3mm 8LD/16LD, 4x4mm 16LD/20LD/24LD, 5x5mm 28LD/32LD. See POD
attachment for details.
Reason For Change
ADI's current Assembly and Test supplier STATS ChipPAC China is relocating their factory by end of September 2017.
In this regard, the affected products currently assembled and tested in that facility will be transferred to new Assembly and Test site to
ensure continuous supply of products.
ADI's assembly subcontractors manufacture products using Analog Devices specified manufacturing flows, materials, process controls and
monitors, ensuring the same level of quality and reliability on products they receive from the new site.
Impact of the change (positive or negative) on fit, form, function & reliability
There will be no impact on the form, fit, function and reliability of the devices.
Product Identification (this section will describe how to identify the changed material)
The parts that will be assembled and tested from the new site will be identified by assembly lot and the country of origin.
Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Qualification Results
Summary. Test correlation and validation has been performed per ADI's standard product site to site change correlation procedure. See
attached Test Correlation Report.
Comments
During transition to new assembly and/or Test Site, products will be Assembled/or Tested from either current or new Assembly and/or Test
Site. The customers may receive products that are assembled at AEK & tested at SCC and/or assembled at SCC & tested at STA.
Applies for all packing/reel options.
Analog Devices, Inc. PCN 16_0234_Rev_B Page 1 of 4

ADA4528-1ACPZ-R7 数据手册

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29 页 / 0.91 MByte
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4 页 / 0.05 MByte

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