Datasheet 搜索 > AD转换器 > TI（德州仪器） > ADC124S021CIMMX/NOPB 数据手册 > ADC124S021CIMMX/NOPB 其他数据使用手册 1/7 页
器件3D模型￥ 35.203
ADC124S021CIMMX/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
AD转换器
封装:
VSSOP-10
描述:
4 通道、50 ksps 至 200 Ksps、12 位模数转换器 10-VSSOP -40 to 85
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1
导航目录
ADC124S021CIMMX/NOPB数据手册
Page:
of 7 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20150505003
PCN Number:
20150505003
PCN Date:
05/14/2015
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
08/14/2015
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire
option for devices listed in “Product affected” section below. Devices will remain in current
assembly facilities and there will be no other piece part changes:
Pkg
Family
Current Wire
Additional Wire
SOT23
Au, 1.0 mil
Cu, 0.96 mil
SOIC
Au, 1.0 mil
Cu, 0.96 mil
VSSOP
Au, 1.0 mil
Cu, 0.96 mil
TSSOP
Au, 1.0 mil
Cu, 0.96 mil
QFN
Au, 1.0 mil
Cu, 0.80 mil
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
None
Product Affected:
See Page 2.
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
