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ADCS7477AIMF 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
AD转换器
封装:
SOT-23-6
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P22P23
原理图在P1P16
封装尺寸在P28P30P31
标记信息在P28P29
封装信息在P27P28P29P30P31
技术参数、封装参数在P1P4
应用领域在P1P33
电气规格在P5P6P7P8P9
导航目录
ADCS7477AIMF数据手册
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4
ADCS7476
,
ADCS7477
,
ADCS7478
SNAS192G –APRIL 2003–REVISED MAY 2016
www.ti.com
Product Folder Links: ADCS7476 ADCS7477 ADCS7478
Submit Documentation Feedback Copyright © 2003–2016, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
Supply voltage, V
DD
–0.3 6.5 V
Voltage on any analog pin to GND –0.3 V
DD
+ 0.3 V
Voltage on any digital pin to GND –0.3 6.5 V
Input current at any pin (except power supply pins) ±10 mA
Soldering temperature, infrared (10 sec) 215 °C
Operating temperature, T
A
150 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±3500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±200
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
Supply voltage 2.7 5.25 V
Digital input pins voltage (independent of supply voltage) 2.7 5.25 V
T
A
Operating temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
ADCS7476,
ADCS7477,
ADCS7478
UNIT
DBV (SOT-23)
6 PINS
R
θJA
Junction-to-ambient thermal resistance 184.5 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 151.2 °C/W
R
θJB
Junction-to-board thermal resistance 29.7 °C/W
ψ
JT
Junction-to-top characterization parameter 29.8 °C/W
ψ
JB
Junction-to-board characterization parameter 29.1 °C/W
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