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ADF7023BCPZ 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
RF射频器件
封装:
LFCSP-32
描述:
ADF7023 Sub-1GHz IEEE 802.15.4g 射频收发器ADF7023 设备是低功率、高性能射频收发器，设计用于在 433MHz、868MHz 和 915MHz 频段下工作。 其符合 IEEE 802.15.4g 和 wMBUS 标准。射频频率范围：431 至 928MHz ISM 频带 射频输出功率：高达 +13.5dBm（单端 PA），高达 +10dBm（差分 PA） 接收器灵敏度：高达 -116dBm @ 1kbps 调制：FSK、GFSK、MSK、GMSK 或 OOK OTA 数据传输率：高达 300kbps 可选 Manchester 编码，8b/10b 编码和数据白化 数字 RSSI 数据包管理支持 Reed Solomon 错误纠正，带硬件加速 AES-128 加密 智能唤醒模式，带载波侦听和数据包嗅探 240 字节数据包缓冲器，用于 Tx/Rx 数据 主机通信：串行 SPI、SPORT 低电池警报和温度传感器 片上 8 位 ADC 电源：+2.2V 至 +3.6V 直流 工作温度范围：-40 至 +85°C 应用：智能计量、IEEE 802.15.4g 系统、家庭自动化、过程和楼宇控制、无线传感器网络、卫生保健、物联网 (IoT) 本地通信 ### 认可FCC、ETSI### 单芯片组件，Analog Devices展开
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ADF7023BCPZ数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
Product/Process Change Notice - PCN 16_0036 Rev. C
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the
last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of
publication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC
Singapore of Select LFCSP Products
Publication Date: 31-Jul-2016
Effectivity Date: 14-Jun-2016 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Added Qualification Results Summary of Automotive LFCSP_SS (Side Solderable).
Description Of Change
The assembly of select LFCSP, Mini LFCSP and Side Solderable LFCSP products is relocating from STATS ChipPAC China Shanghai to
STATS ChipPAC China Jiangyin. The testing will transfer from STATS ChipPAC China Shanghai to STATS ChipPAC Singapore. The package
outline dimensions and BOM of each product will be maintained.
Reason For Change
ADI Assembly is transferring to STATS ChipPAC China Jiangyin and Test will move to STATS ChipPAC Singapore due to the relocation of
STATS ChipPAC China Shanghai at the end of September 2017.
ADI's assembly and test subcontractors manufacture products using Analog Devices specified manufacturing flows, materials, process
controls and monitors, ensuring the same level of quality and reliability on products they receive from the new site.
Impact of the change (positive or negative) on fit, form, function & reliability
The transfer will have no impact on the form, fit, function and reliability of the devices.
Product Identification (this section will describe how to identify the changed material)
The parts that will be assembled and tested after the transfer will be identified by assembly lot and the country of origin.
Summary of Supporting Information
Qualifications are completed per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Results. Test
Correlation and validation will be performed, see the attached Test Qual Plan.
Comments
This applies for all packing/reel options.
During the transition to the New Assembly and Test Site, products will be Assembled and Tested from the either Current or New Assembly
and Test Site.
Example: SCC Assembly and Test to SC3 Assembly and STA Test,
the customers may receive products that are assembled at either SCC or SC3 and tested at either SCC or STA.
Analog Devices, Inc. PCN 16_0036_Rev_C Page 1 of 5
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