ADT75BRMZ 产品修订记录 - ADI（亚德诺）

Product/Process Change Notice - PCN 15_0176 Rev. -

Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106

This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the

last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of

publication date. ADI contact information is listed below.

PCN Title: Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines

Publication Date: 26-Oct-2015

Effectivity Date: 24-Jan-2016 (the earliest date that a customer could expect to receive changed material)

ADI has qualified Amkor's standard assembly bill of materials. See attachment for changes to die attach and mold compound.

ADI is currently running high volume production on other packages at Amkor Philippines

Reason For Change

ADI is transferring to Amkor Philippines due to current assembly house will no longer support the 8/10L MSOP package by end of 2016

ADI assembly suppliers manufacture ADI products using Analog Devices specified assembly process flows, materials, process controls and

monitors. This assures that ADI customers receive the same level of quality and reliability on products they receive from different

manufacturing locations.

Impact of the change (positive or negative) on fit, form, function & reliability

Qualification has been performed per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Results

Summary.

Supporting Documents

Attachment 1: Type: Detailed Change Description

ADI_PCN_15_0176_Rev_-_MSOP_Material Set Changes to Amkor.docx

Analog Devices, Inc. PCN 15_0176_Rev_- Page 1 of 5