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AM29F200BB-70EE 其他数据使用手册 - Cypress Semiconductor（赛普拉斯）
制造商:
Cypress Semiconductor（赛普拉斯）
封装:
TSOP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9Hot
原理图在P6
封装尺寸在P65P66
型号编码规则在P1P4P10P11P48P69
标记信息在P10
功能描述在P4
技术参数、封装参数在P1P48P50
电气规格在P3
型号编号列表在P1
导航目录
AM29F200BB-70EE数据手册
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若手册格式错乱，请下载阅览PDF原文件
Publication Number 25263 Revision C Amendment +6 Issue Date December 16, 2005
Am29LV256M
Data Sheet
RETIRED
PRODUCT
This product has been retired and is not available for designs. For new and current designs,
S29GL256N supersedes Am29LV256M and is the factory-recommended migration path. Please refer
to the S29GL256N datasheet for specifications and ordering information. Availability of this docu-
ment is retained for reference and historical purposes only.
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that
originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appro-
priate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
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