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APT42F50B
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“CoolMOS” comprise a new family of transistors developed by Infineon Technologies AG.
“CoolMOS” is a trademark of Infineon Technologies AG.
ASPM®, Power MOS 7® & T-MAX® are registered trademarks of Microsemi Corporation.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for
communications, defense and security, aerospace, and industrial markets. Products include high-performance and radi-
ation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs, and ASICs; power management products; timing
and synchronization devices and precise time solutions; voice processing devices; RF solutions; discrete components;
enterprise storage and communications solutions, security technologies, and scalable anti-tamper products; Ethernet
solutions; Power-over-Ethernet ICs and midspans; custom design capabilities and services. Microsemi is headquartered
in Aliso Viejo, California, and has approximately 4,800 employees worldwide. Learn more at www.microsemi.com.
CONTENTS
HIGH VOLTAGE SMPS TRANSISTORS Page No.
IGBTs (Insulated Gate Bipolar Transistors) ......................................................................3-5
SiC and Power MOS 8
TM
MOSFETs / FREDFETs ...............................................................6-8
Ultra-Fast Low Gate Charge MOSFETs ..............................................................................9
CoolMOS
TM
MOSFETs ...................................................................................................... 10
High Voltage Linear MOSFETs .........................................................................................10
DIODES
SiC Schottky and Ultra Fast Recovery Diodes ............................................................11-13
HIGH VOLTAGE RF MOSFETS ........................................................................................ 14
HIGH FREQUENCY RF MOSFETS .................................................................................. 14
DRIVER-RF MOSFET HYBRIDS ...................................................................................... 15
REFERENCE DESIGN KITS ............................................................................................. 15
POWER MODULES
Contents .......................................................................................................................... 16
Electrical Configuration ................................................................................................... 17
Packaging ........................................................................................................................ 18
Know How and Capabilities .......................................................................................19-20
Part Numbering System ................................................................................................... 21
IGBTs (Insulated Gate Bipolar Transistors) ................................................................22-25
MOSFETs ....................................................................................................................26-30
Renewable Energy Power Modules ............................................................................30-31
SiC Power Modules.....................................................................................................32-34
Diodes and Rectifiers ...................................................................................................... 35
PACKAGE OUTLINE DRAWINGS ..............................................................................36-39

APT42F50B 数据手册

Microsemi(美高森美)
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Microsemi(美高森美)
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Microsemi(美高森美)
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