Datasheet 搜索 > 存储芯片 > Microchip（微芯） > AT24C01C-STUM-T 数据手册 > AT24C01C-STUM-T 产品修订记录 1/4 页
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AT24C01C-STUM-T 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
存储芯片
封装:
SOT-23-5
描述:
电可擦除可编程只读存储器 1K 2-WIRE 5 SOT23 PB/HALO FREE, 1.7V
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符号图
焊盘图
引脚图
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页面导航:
标记信息在P2
型号编号列表在P4
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AT24C01C-STUM-T数据手册
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QF-8004 Rev. 18 Page 1 of 3
07/22/16 PCN Ref. Number [SC164804]
PRODUCT / PROCESS CHANGE NOTIFICATION (PCN)
PCN Number:
SC164804
Notification Subject:
CCB 2716 and CRB 16-1021 Final Notice: Qualification of top
marking, assembly and final test site at MTAI as an additional
site for selected AT24Cxx device family available in 5L SOT-23
package.
PCN Issue Date:
December 14, 2016
Change Category:
Manufacturing
PCN Status:
Final Notification
Microchip/Atmel
Parts Affected:
Please open the attachments included with this PCN labeled
as PCN_#_Affected_CPN.
Note: for your convenience Microchip/Atmel includes identical
files in two formats (.pdf and .xls)
Description of
Change:
Qualification of top marking, assembly and final test site at
MTAI as an additional site for selected AT24Cxx device family
available in 5L SOT-23 package.
Pre Change:
Assembled and final tested at UTAC and ANAP (ATP) with 1
line top and bottom marking.
Post Change:
Assembled and final tested at UTAC, ANAP (ATP) or MTAI
with 2 line top marking and no bottom mark.
Pre and Post Change
Summary:
Description
Pre Change
Post Change
Assembly
UTAC and ANAP (ATP)
UTAC, ANAP (ATP)
or MTAI
Final Test
UTAC and ANAP (ATP)
UTAC, ANAP (ATP)
or MTAI
Wire Material
Au or Cu
Au or Cu
Die Attach Material
8390A
8390A
Molding compound
Material
G600V
G600V
Lead frame
Material
CDA194
CDA194
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