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器件3D模型￥ 1.508
AT24C64D-XHM-T 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
EEPROM芯片
封装:
TSSOP-8
描述:
AT24C64D-XHM-T 编带
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P5P6Hot
原理图在P8
封装尺寸在P23P32P33P36
型号编码规则在P23
标记信息在P23
封装信息在P23P24P25P26P27P28P29P30P31P32P33P36
技术参数、封装参数在P9P11
电气规格在P9P10P11P12
型号编号列表在P36
导航目录
AT24C64D-XHM-T数据手册
Page:
of 39 Go
若手册格式错乱，请下载阅览PDF原文件
AT24C64D
I²C-Compatible (Two-Wire) Serial EEPROM 64-Kbit
(8,192 x 8)
Features
• Low-Voltage Operation:
– V
CC
= 1.7V to 5.5V
• Internally Organized as 8,192 x 8 (64K)
• Industrial Temperature Range: -40°C to +85°C
• I
2
C-Compatible (Two-Wire) Serial Interface:
– 100 kHz Standard Mode, 1.7V to 5.5V
– 400 kHz Fast Mode, 1.7V to 5.5V
– 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• Write-Protect Pin for Full Array Hardware Data Protection
• Ultra Low Active Current (3 mA maximum) and Standby Current (6 µA maximum)
• 32-byte Page Write Mode:
– Partial page writes allowed
• Random and Sequential Read Modes
• Self-Timed Write Cycle within 5 ms Maximum
• ESD Protection > 4,000V
• High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
• Green Package Options (Lead-free/Halide-free/RoHS compliant)
• Die Sale Options: Wafer Form and Bumped Wafers
Packages
• 8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN, 8-Pad XDFN and 8-Ball VFBGA
© 2018-2020 Microchip Technology Inc.
Datasheet
DS20005937C-page 1
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