Datasheet 搜索 > 微控制器 > Microchip（微芯） > AT89C51ED2-RDRUM 数据手册 > AT89C51ED2-RDRUM 产品修订记录 1/4 页
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AT89C51ED2-RDRUM 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
LQFP-64
描述:
51系列 60MHz 64K@x8bit
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1
型号编号列表在P4
导航目录
AT89C51ED2-RDRUM数据手册
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Page 1 of 3
Product Change Notification / RMES-20UKIQ053
Date:
21-Oct-2020
Product Category:
8-bit Microcontrollers
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4410 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire
for selected products available in 64L LQFP (10x10x1.4mm) package using 236 x 236 mils lead frame
paddle size at ANAP assembly site.
Affected CPNs:
RMES-20UKIQ053_Affected_CPN_10212020.pdf
RMES-20UKIQ053_Affected_CPN_10212020.csv
Notification Text:
PCN Status: Initial notification
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products
available in 64L LQFP (10x10x1.4mm) package using 236 x 236 mils lead frame paddle size at ANAP assembly site.
Pre Change:
Using palladium copper bond wire (CuPd) or palladium gold (AuPd) with 236 x 236 mils or 197 x 197 mils paddle size
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire with 236 x 236 mils paddle size
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