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AT93C46E-PU
器件3D模型
2.001
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AT93C46E-PU数据手册
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Product Change Notification
ATMEL Colorado Springs 1150 E, Cheyenne Mtn, Blvd Colorado Springs CO 80906 USA
QF-8004 Rev. 14
09/05/14 Page 1 of 3
PCN Number: CC144702 Notification Date: December 3, 2014
Title: Serial EEPROM Copper (Cu) Bond Wire Change
Product Identification:
AT24Cxxx (I
2
C) Industrial Temperature Grade (-40°C to +85°C) Serial EEPROM products:
All PDIP and SOT23 package versions, including all customer assigned part numbers (CAN)
PDIP base catalog part numbers
AT24C01C-PUM
AT24C01D-PUM
AT24C04C-PUM
AT24C08C-PUM
AT24C16C-PUM
AT24C02C-PUM
AT24C02D-PUM
AT24C04D-PUM
AT24C08D-PUM
AT24C16D-PUM
AT24HC02C-PUM
SOT23 base catalog part numbers
AT24C01C-STUM-T
AT24C02C-STUM-T
AT24C04C-STUM-T
AT24C08C-STUM-T
AT24C01D-STUM-T
AT24C02D-STUM-T
AT24C04D-STUM-T
AT24C08D-STUM-T
AT24C16C-STUM-T
AT24C16D-STUM-T
AT24C32D-STUM-T
AT25xxx (SPI) Industrial Temperature Grade (-40°C to +85°C) Serial EEPROM products, and
AT93xxx (µWire) Industrial Temperature Grade (-40°C to +85°C) Serial EEPROM products:
All PDIP package versions (SOT23 is not available for SPI products or µWire), including all customer
assigned part numbers (CAN)
AT93C46E-BPU
AT93C46E-PU
This PCN also applies to all customer specific CAN part numbers that are not listed in the tables. Contact
Atmel for with any questions on support for CAN parts with Cu bond wires.
Reason for Change:
Material / Composition
Processing / Manufacturing
Design / Firmware
Datasheet
Manufacturing Location
Quality / Reliability
Logistics
Other:
Change Description:
Copper (Cu) bond wire usage
In order to increase manufacturing flexibility and to ensure a long-term continuity of supply, Atmel will
manufacture 8-lead PDIP and 5-lead SOT23 packages using both gold (Au) and copper bond (Cu) wires.
Atmel reserves the right to ship devices with either gold or copper bond wires. The change does not impact
reliability, soldering profiles or electrical characteristics. Qualification data is available upon request.

AT93C46E-PU 数据手册

Microchip(微芯)
17 页 / 0.42 MByte
Microchip(微芯)
36 页 / 0.76 MByte
Microchip(微芯)
3 页 / 0.18 MByte
Microchip(微芯)
1 页 / 0.12 MByte

AT93C46 数据手册

ATMEL(爱特美尔)
EEPROMs-串行存储器 AT93C46 8s1/SOIC8
ATMEL(爱特美尔)
ATMEL  AT93C46DN-SH-T  EEPROM, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, 串行, SOIC, 8 引脚
Microchip(微芯)
1-Kbit(128 x 8bit or 64 x 16bit),SPI接口,工作电压:1.8V to 5.5V
Microchip(微芯)
EEPROM, 串行 3-线, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, DIP, 8 引脚
ATMEL(爱特美尔)
ATMEL  AT93C46D-PU  EEPROM, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, 串行微丝, DIP, 8 引脚
ATMEL(爱特美尔)
ATMEL  AT93C46DN-SH-B  EEPROM, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, 串行微丝, SOIC, 8 引脚
Microchip(微芯)
EEPROM, 串行 3-线, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, SOIC, 8 引脚
Microchip(微芯)
电可擦除 PROM 串行存取### EEPROM 串行存取 - Microchip
Microchip(微芯)
EEPROM, 串行 3-线, 1 Kbit, 64 x 16位, 2 MHz, SOIC, 8 引脚
Microchip(微芯)
EEPROM, 串行 3-线, 1 Kbit, 128 x 8位 / 64 x 16位, 2 MHz, TSSOP, 8 引脚
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