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器件3D模型￥ 81.785
ATMEGA1281V-8MU 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
QFN-64
描述:
8 位 megaAVR 微控制器，32KB 到 256KB 闪存我们在 RS Components 提供多款来自 Atmel 的 megaAVR 8 位微控制器。 每个微控制器均基于增强型 RISC 体系结构，并具有 QTouch 库支持。 所有微控制器类型具有不同 Kb 的系统内可编程内存、EEPROM 和 SRAM 以及不同引脚和封装类型。 **megaAVR 8 位微控制器类型** ATmega32 ATmega64 ATmega128 ATmega324 ATmega325 ATmega406 ATmega640 ATmega644 ATmega645 ATmega1280 ATmega1281 ATmega1284 ATmega2560 ATmega2561 ATmega3250 ATmega6450
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P14P50Hot
原理图在P1P24P27P29P38P50P122P124
封装尺寸在P126
封装信息在P126
焊接温度在P127
功能描述在P1
技术参数、封装参数在P16P17P18P19P20P21P22
应用领域在P1P130
电气规格在P17P18P22
型号编号列表在P16
导航目录
ATMEGA1281V-8MU数据手册
Page:
of 130 Go
若手册格式错乱，请下载阅览PDF原文件
SX1280/SX1281
Data Sheet Rev 1.1
DS.SX1280-1.W.APP May 2017
6 of 130
Semtech
www.semtech.com
11.8.3 ClearIrqStatus..................................................................................................................... 82
12. List of Commands ...................................................................................................................................... 83
13. Transceiver Operation.............................................................................................................................. 85
13.1 GFSK Packet .................................................................................................................................... 85
13.1.1 Common Transceiver Settings..................................................................................... 85
13.1.2 Tx Setting and Operations............................................................................................. 91
13.1.3 Rx Setting and Operations............................................................................................. 92
13.2 BLE Packet ........................................................................................................................................ 94
13.2.1 Common Transceiver Settings..................................................................................... 94
13.2.2 Tx Setting and Operations............................................................................................. 98
13.2.3 Rx Setting and Operations............................................................................................. 99
13.2.4 BLE Specific Functions ..................................................................................................101
13.3 FLRC Packet ...................................................................................................................................102
13.3.1 Common Transceiver Settings................................................................................... 102
13.3.2 Tx Setting and Operations...........................................................................................107
13.3.3 Rx Setting and Operations...........................................................................................108
13.4 LoRa Packet ...................................................................................................................................111
13.4.1 Common Transceiver Settings for LoRa .................................................................111
13.4.2 Tx Setting and Operations...........................................................................................114
13.4.3 Rx Setting and Operations...........................................................................................114
13.5 Settings for Ranging ..................................................................................................................116
13.5.1 Ranging Device Setting ................................................................................................116
13.5.2 Ranging Operation as State Machines....................................................................120
13.6 Miscellaneous Functions ..........................................................................................................121
13.6.1 SetRegulatorMode Command ...................................................................................121
13.6.2 Context Saving.................................................................................................................121
14. Reference Design and Application Schematics ............................................................................122
14.1 Reference Design ........................................................................................................................122
14.1.1 Application Design Schematic...................................................................................122
14.1.2 Reference Design BOM .................................................................................................123
14.1.3 Reference Design PCB...................................................................................................123
14.2 Application Design with optional TCXO ............................................................................. 124
14.3 Application Design with Low Drop Out Regulator .........................................................124
14.4 Sleep Mode Consumption .......................................................................................................125
15. Packaging Information...........................................................................................................................126
15.1 Package Outline Drawing ........................................................................................................126
15.2 Land Pattern .................................................................................................................................127
15.3 Reflow Profiles ..............................................................................................................................127
15.4 Thermal Impedance ...................................................................................................................127
Glossary ..............................................................................................................................................................128
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