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ATMEGA169PV-8AUR 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-64
描述:
8位 MCU微控制单元, 低功率高性能, AVR ATmega Family ATmega16X Series Microcontrollers, 8 MHz, 16 KB, 1 KB, 64 引脚
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焊盘图
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产品图
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封装尺寸在P16
型号编号列表在P4
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ATMEGA169PV-8AUR数据手册
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Product Change Notification - GBNG-05QUVX037
Date:
04 Mar 2019
Product Category:
8-bit Microcontrollers
Affected CPNs:
Notification subject:
CCB 3496 and 3496.001 Final Notice: Qualification of MMT as an additional assembly site for
selected Atmel products of the 35.4K, 35.5K and 35.9K wafer technologies available in 64L TQFP
(14x14x1.0mm) and 100L TQFP (14x14x1.0mm) packages.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected Atmel products of the 35.4K, 35.5K
and 35.9K wafer technologies available in 64L TQFP (14x14x1.0mm) and 100L TQFP
(14x14x1.0mm) packages.
Pre Change:
Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H
mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire,
CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at
ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold
compound and C194 lead frame material.
Post Change:
Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H
mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire,
CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at
ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold
compound and C194 lead frame material or assembled in MMT using Au wire, 3280 die attach,
G700 mold compound and C194 lead frame material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly
Site
ASE Inc.
Taiwan
(ASE)
Lingse
n
Precisi
on
Industri
es,
LTD.
(LPI)
Amkor
Technology
Philippine
(P1/P2), INC.
(ANAP)
ASE Inc. Taiwan
(ASE)
Lingsen
Precisio
n
Industrie
s, LTD.
(LPI)
Amkor
Technology
Philippine
(P1/P2), INC.
(ANAP)*
Mic
roc
hip
Tec
hno
logy
Tha
ilan
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