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ATMEGA16M1-AU 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-32
描述:
8 位 megaAVR 微控制器，带 CAN 控制器这些 megaAVR® 微控制器具有控制器区域网络 (CAN) 2.0A/B 控制器，且经过 ISO 16845 认证。它们还可提供大量程序和数据内存，性能高达 20 MIPS。 所有 megaAVR 均提供自动编程功能，可实现快速、安全、经济实惠的在线升级。
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ATMEGA16M1-AU数据手册
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若手册格式错乱，请下载阅览PDF原文件
Date:
08 May 2017
Product Category:
Capacitive Touch Sensors; 8-bit PIC Microcontrollers
Notification subject:
CCB 2913 Initial Notice: Qualification of MTAI as an additional assembly site for selected Atmel
products available in 32L TQFP (7x7x1 mm) package using CuPdAu bond wire.
Notification text:
PCN Status:
Initial notification.
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MTAI as an additional assembly site for selected Atmel products available in 32L TQFP (7x7x1 mm)
package using palladium coated copper with gold flash (CuPdAu) bond wire.
Pre Change:
Assembled at LPI, ANAK (ATK) or ANAP (ATP) using gold (Au) or palladium coated copper (PdCu) bond wire.
Post Change:
Assembled at LPI, ANAK (ATK), ANAP (ATP) using gold (Au) or palladium coated copper (PdCu) bond wire or
Assembled at MTAI using palladium coated copper with gold flash (CuPdAu) bond wire.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site LPI ANAK ANAP LPI ANAK ANAP MTAI
Lead frame
material
C7025 CDA194 CDA194 C7025 CDA194 CDA194 C7025
Wire material Au or PdCu Au or PdCu Au or PdCu Au or PdCu Au or PdCu Au or PdCu CuPdAu
Die attach
material
CRM1033BF 3230 3230 CRM1033BF 3230 3230 3280
Mold
compound
material
G700 G700 G700
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying MTAI as an additional assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
August 2017
Note: Please be advised the qualification completion times may be extended because of unforeseen business
conditions however implementation will not occur until after qualification has completed and a final PCN has been
Product Change Notification - RMES-10NGWL694
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=RME
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