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ATMEGA644P-20PU 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-40
描述:
8 位 PicoPower megaAVR 系列微控制器此系列 megaAVR 微控制器具有 picoPower 技术 — 非常适合节能。 它们提供大量程序和数据内存，性能高达 20 MIPS。 **picoPower megaAVR 微控制器的特色和优点** 片上闪存 SRAM 内部 EEPROM SPI TWI (I²C) USART、USB、CAN 和 LIN 接口 监控计时器 精密振荡器 GPIO 引脚 ADC DAC 内置温度传感器 内部参考电压 掉电检测器
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ATMEGA644P-20PU数据手册
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Product Change Notification - GBNG-26MNLV879
Date:
28 May 2020
Product Category:
8-bit Microcontrollers
Affected CPNs:
Notification subject:
CCB 3600.004, 3600.005 and 3600.006 Final Notice: Qualification of MMT as a new assembly site
for selected Atmel products available in 8L, 14L and 40L PDIP packages.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as a new assembly site for selected Atmel products available in 8L, 14L and
40L PDIP packages.
Pre Change:
Assembled at LPI assembly site using gold (Au) or palladium coated copper with gold flash
(CuPdAu) bond wire, CRM-1033BF die attach and G600 mold compound material.
Post Change:
Assembled at MMT assembly site using palladium coated copper with gold flash (CuPdAu) bond
wire, CRM-1064L die attach and GE800 mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Lingsen Precision
Industries, Taiwan. (LPI)
Microchip Technology
Thailand (Branch) - (MMT)
Wire material
Au CuPdAu CuPdAu
Die attach material
CRM-1033BF CRM-1064L
Molding compound
material
G600 GE800
Lead frame material
CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on time delivery performance by qualifying MMT as a new assembly site. Due to
unforeseen business conditions the LPI location will be discontinued as an assembly site for 8L, 14L
and 40L PDIP packages.
Change Implementation Status:
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