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ATMEGA64M1-MU
器件3D模型
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ATMEGA64M1-MU数据手册
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Pre and Post Change Summary:
Pre Change
Post Change
Fabrication Supplier and
Location
Microchip Technology
Colorado – Fab 5 (MCSO)
Microchip Technology
Colorado – Fab 5 (MCSO)
Microchip Technology Tempe –
Fab 2 (TMGR)
Wafer Diameter
6 inches
6 inches
8 inches
Die size
No change
No change
No change
Quality Certification
ISO9001/TS16949 or
IATF16949
ISO9001/TS16949 or
IATF16949
ISO9001/TS16949 or IATF16949
Impacts to Data Sheet:None
Change Impact:None
Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication
source at Microchip Technology Tempe – Fab 2 (TMGR) fabrication site.
Change Implementation Status:
In Progress
Estimated First Ship Date:January 11, 2021 (date code: 2103)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Time Table Summary:
December 2019
-
-
>
January 2021
49
50
51
52
01
02
03
04
05
X
X
*X
*X
*Note:
Due to unforeseen circumstances, that are out of Microchip’s control, the estimated first ship date may have occurred prior
to the qualification completion, as documented in the time table summary, so that Microchip may maintain continuity of
supply and not disrupt customer orders.
Method to Identify Change: Traceability code
Qualification Report:Please open the attachments included with this PCN labeled as PCN_#_Qual_Report
Revision History:December 11, 2019: Issued initial notification.January 08, 2020: Re-issued initial notification to update the

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ATMEGA64M1 数据手册

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