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B10011S-MFPG1 其他数据使用手册 - ATMEL（爱特美尔）
制造商:
ATMEL（爱特美尔）
分类:
接口芯片
封装:
SOIC-16
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B10011S-MFPG1数据手册
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若手册格式错乱，请下载阅览PDF原文件
ATMEL San Jose 1600 Technology Dr, San Jose CA 95110 USA
QF-8004 Rev. 18 Page 2 of 3
07/21/16 PCN Ref. Number [SC163003]
Impacts to Data Sheet:
Change Impact:
Reason for Change:
Change Implementation
Status:
Desiccants
Clay or Silica Gel
Desiccants
Clay desiccants
only
Humidity
Indicator Card
(HIC)
Only Cobalt
Dichloride Free
Free of all Cobalt
compounds
Shipping
Boxes
Includes the Atmel
Logo
Includes Microchip
Logo
Inner/Outer
Shipping Label
Atmel branded
labels
Microchip branded
labels
Without 2D bar
code
With 2D barcode
MSL 1 Packing
Procedure
(tube and tape
and reel
packages only)
With Inner box
Without inner box
None
None
To improve productivity and on time delivery performance
as part of the integration of Atmel and Microchip
In progress
Estimated Implementation
Date:
Time Table Summary:
Method to Identify Change:
Qualification Report:
November 1, 2016
NOTE: The earliest implementation date is the earliest
date that we may implement any combination of the
changes listed in this PCN as we will not implement any
of the proposed changes prior to this date. After the
earliest implementation date these changes may occur to
any product over the course of many months depending
on inventory levels and business conditions.
September 2016
->
November 2016
Workweek
36
37
38
39
45
46
47
48
Final PCN Issue Date
X
Estimated
Implementation Date
X
Traceability, label, inner and outer boxes.
Solderability Assessment
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