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BAS321,115 产品修订记录 - Nexperia（安世）
制造商:
Nexperia（安世）
封装:
SOD-323
描述:
BAS321 系列 250 V 250 mA 表面贴装 通用 二极管 - SOD-323
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P4
标记信息在P1
应用领域在P11P21P24P49P59
导航目录
BAS321,115数据手册
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Customer Information Notification
201311006I
Issue Date: 02-Jan-2014
Effective Date: 03-Feb-2014
Dear I.H.S.,
Please find below a Quality Notification that has been distributed by NXP.
Management Summary
NXP will introduce new reel design for lighter packing using less material.
Change Category
[ ] Wafer Fab process
[ ] Assembly Process
[ ] Product Marking
[ ] Design
[ ] Wafer Fab materials
[ ] Assembly Materials
[ ] Electrical spec./Test coverage
[ ] Mechanical Specification
[ ] Wafer Fab location
[ ] Assembly Location
[ ] Test Location
[X] Packing/Shipping/Labeling
Introducing lighter reels for tape & reel packing at APG and APM
Information Notification
As announced through GN 2013100002 NXP will introduce a new reel design using less materials.
Through this CIN NXP communicates the introduction of three reels at assembly sites APG and APM.
These reels have been tested and fulfil our packing requirements and are in compliance with EIA-481D and IEC60286-3.
Conversion for the products in this phase will start per February 2014, to be finalized in 2014 (please see remark).
Stock of reels with 'old' design will be used up before delivery of products in light weight reels will start.
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