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BAS40057F 其他数据使用手册 - Vishay Semiconductor（威世）
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肖特基二极管
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BAS40057F数据手册
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BAS40 /-04 /-05 /-06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
• Low Forward Voltage Drop
• Fast Switching
• PN Junction Guard Ring for Transient and ESD Protection
• Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagrams Below
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
Top View BAS40 BAS40-04 BAS40-05 BAS40-06
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
40 V
Forward Continuous Current (Note 1)
I
FM
200 mA
Forward Surge Current (Note 1) @ t < 1.0s
I
FSM
600 mA
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
350 mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
θ
JA
357 °C/W
Operating Temperature Range
T
J
-55 to +125 °C
Storage Temperature Range
T
STG
-65 to +150 °C
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
40
⎯ ⎯
V
I
R
= 10μA
Forward Voltage
V
F
⎯ ⎯
380
1000
mV
t
p
< 300μs, I
F
= 1.0mA
t
p
< 300μs, I
F
= 40mA
Reverse Leakage Current (Note 2)
I
R
⎯
20 200 nA
t
p
< 300μs, V
R
= 30V
Total Capacitance
C
T
⎯
4.0 5.0 pF
V
R
= 0V, f =1.0MHz
Reverse Recovery Time
t
rr
⎯ ⎯
5.0 ns
I
F
= I
R
= 10mA to I
R
= 1.0mA,
R
L
= 100Ω
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BAS40 /-04 /-05 /-06
Document number: DS11006 Rev. 21 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated
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