Web Analytics
Datasheet 搜索 > Taiwan Semiconductor(台湾半导体) > BAS70 数据手册 > BAS70 产品封装文件 1/5 页
BAS70
0.598
导航目录
  • 封装尺寸在P4
  • 焊盘布局在P4
  • 型号编码规则在P1
  • 标记信息在P2
  • 封装信息在P1
  • 功能描述在P1
  • 电气规格在P2
BAS70数据手册
Page:
of 5 Go
若手册格式错乱,请下载阅览PDF原文件
BAS70/ -04/ -05/ -06
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Product Summary
V
R
(V) I
F
(mA)
V
F MAX
(V)
@ +25°C
I
R MAX
(uA)
@ +25°C
70
1.0
0.41
0.1
Description
70mA surface mount Schottky Barrier Diode in SOT23 package,
offers low forward voltage drop and fast switching capability,
designed with PN Junction Guard Ring for Transient and ESD
Protection.
Features and Benefits
Low Turn-On Voltage
Fast Switching
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe)
Polarity: See Diagrams Below
Weight: 0.008 grams (approximate)
Top View
BAS70-04
Ordering Information (Note 4 & 5)
Part Number
Case
Packaging
BAS70-7-F
SOT23
3000/Tape & Reel
BAS70-04-7-F
SOT23
3000/Tape & Reel
BAS70-04Q-7-F
SOT23
3000/Tape & Reel
BAS70-04Q-13-F
SOT23
10000/Tape & Reel
BAS70-05-7-F
SOT23
3000/Tape & Reel
BAS70-06-7-F
SOT23
3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
5. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
e3
BAS70/ -04/ -05/ -06
Document number: DS11007 Rev. 24 - 2
1 of 5
www.diodes.com
August 2014
© Diodes Incorporated

BAS70 数据手册

Taiwan Semiconductor(台湾半导体)
4 页 / 0.17 MByte
Taiwan Semiconductor(台湾半导体)
3 页 / 0.11 MByte
Taiwan Semiconductor(台湾半导体)
5 页 / 0.2 MByte
器件 Datasheet 文档搜索
器件加载中...
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件