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BCW30 其他数据使用手册 - Central Semiconductor
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BCW30数据手册
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© Semiconductor Components Industries, LLC, 1999
November, 2016 − Rev. 4
1 Publication Order Number:
BCW30LT1/D
BCW30LT1G, SBCW30LT1G
General Purpose
Transistors
PNP Silicon
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage V
CEO
−32 Vdc
Collector − Base Voltage V
CBO
−32 Vdc
Emitter-Base Voltage V
EBO
−5.0 Vdc
Collector Current − Continuous I
C
−100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Total Device Dissipation
FR-5 Board (Note 1)
T
A
= 25°C
Derate above 25°C
P
D
225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
556 °C/W
Total Device Dissipation
Alumina Substrate (Note 2)
T
A
= 25°C
Derate above 25°C
P
D
300
2.4
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
417 °C/W
Junction and Storage Temperature T
J
, T
stg
−55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
Device Package Shipping
ORDERING INFORMATION
SOT−23 (TO−236)
CASE 318−08
STYLE 6
MARKING DIAGRAM
COLLECTOR
3
1
BASE
2
EMITTER
1
C2 M G
G
C2 = Specific Device Code
M = Date Code*
G = Pb−Free Package
BCW30LT1G SOT−23
(Pb−Free)
3,000/Tape & Reel
†
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
SBCW30LT1G SOT−23
(Pb−Free)
3,000/Tape & Reel
www.onsemi.com
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