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BCW68GLT1G 其他数据使用手册 - ON Semiconductor（安森美）
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ON Semiconductor（安森美）
分类:
双极性晶体管
封装:
SOT-23-3
描述:
ON SEMICONDUCTOR BCW68GLT1G 单晶体管 双极, PNP, -45 V, 100 MHz, 225 mW, -800 mA, 60 hFE
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BCW68GLT1G数据手册
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Issue Date: 11 Jul 2008 Rev.07-02-06 Page 1 of 14
PRODUCT BULLETIN
Generic Copy
11 Jul 2008
SUBJECT: ON Semiconductor Product Bulletin #16134
TITLE: SOT-23 Possible Adhesion Issue using Glue Mount Process
PROPOSED FIRST SHIP DATE: 11 Jul 2008
AFFECTED PRODUCT DIVISION: SOT-23 Products
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor sales office or Mark Wasilewski<m.wasilewski@onsemi.com
>
NOTIFICATION TYPE:
Product Alert
DESCRIPTION AND PURPOSE:
ON Semiconductor wishes to notify you of a potential manufacturability concern with SOT-23 devices. This
problem is very customer board mounting specific and you may not
experience any issue with these parts. ON
Semiconductor believes in proactively notifying our customers of any potential issue.
Background of potential manufacturing concern:
This issue is very process specific and is not a reliability concern as it only affects the initial board mount
process for those customers using double-sided boards with wave solder. A few of ON Semiconductor’s
customers have reported an issue with SOT-23 devices under these conditions only. The reported issue may occur
during board mounting using wave solder after gluing the devices to the bottom side of the board resulting in
components falling off of the board.
Date codes affected:
SOT-23 devices from date code 0814
ON Semiconductor actions:
ON Semiconductor has identified the issue to be related to:
1. Customer mounting process
Again, this issue only affects customers using SOT-23 components for bottom side board placement that are glued
into place prior to wave solder. Any components used for top side placement or normal IR Furnace pass will not
be affected by this issue. Glue types used also have an impact.
2. Mold compound variability from date code 0814
ON Semiconductor has performed adhesion testing and has verified transient variability in adhesion strength since
the original qualification of the mold compound. ON Semiconductor is working with our mold compound supplier
to understand this variability and correct it.
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