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BZX84C20
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BZX84C20数据手册
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BZX84C2V4W - BZX84C39
W
200mW SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
200mW Power Dissipation
Zener Voltages from 2.4V – 39V
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 4)
"Green" Device (Notes 1 and 2)
Mechanical Data
Case: SOT-323
Case Material: Molded Plastic, "Green" Molding Compound,
Note 2. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.006 grams (approximate)
Top View
Device Schematic
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F =
10mA V
F
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3)
P
D
200 mW
Thermal Resistance, Junction to Ambient Air (Note 3)
R
θ
JA
625 K/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +125
°C
Notes: 1. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com./products/lead_free/index.php.
2. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
3. Mounted on FR4 PC board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
4. No purposefully added lead.
BZX84C2V4W - BZX84C39W
Document number: DS30066 Rev. 15 - 2
1 of 4
www.diodes.com
May 2008
© Diodes Incorporated
Please click here to visit our online spice models database.

BZX84C20 数据手册

ON Semiconductor(安森美)
4 页 / 1.36 MByte
ON Semiconductor(安森美)
7 页 / 0.56 MByte
ON Semiconductor(安森美)
1 页 / 0.04 MByte
ON Semiconductor(安森美)
4 页 / 0.14 MByte
ON Semiconductor(安森美)
1 页 / 0.12 MByte

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