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BZX84C8V2-7-F
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BZX84C8V2-7-F数据手册
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BZX84C2V4 - BZX84C39
Document number: DS18001 Rev. 28 - 2
1 of 4
www.diodes.com
April 2010
© Diodes Incorporated
BZX84C2V4 - BZX84C39
350mW SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
350mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.008 grams (approximate)
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F
= 10mA V
F
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
300 mW
Power Dissipation (Note 2)
P
D
350 mW
Thermal Resistance, Junction to Ambient Air (Note 1)
R
θ
JA
417
°C/W
Thermal Resistance, Junction to Ambient Air (Note 2)
R
θ
JA
357
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-65 to +150
°C
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Valid provided the terminals are kept at ambient temperature.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code OW (week 42, 2009) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
Top View
Device Schematic
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