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CD74HC4067M96E4 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
SOIC-24
描述:
高速CMOS逻辑16通道模拟多路复用器/多路解复用器 High-Speed CMOS Logic 16-Channel Analog Multiplexer/Demultiplexer
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CD74HC4067M96E4数据手册
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Texas Instruments, Inc. PCN# 20160606003A
PCN Number:
20160606003A
PCN Date:
06/24/2016
Title:
Qualify New Assembly Material set for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
09/24/2016
Estimated Sample Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision A is to announce the addition of new devices that were not included on the original PCN
notification. Please refer to the Product affected section for the additional devices. The expected
first shipment date for these new devices will be 90 days from this notice for these newly added
devices only. Devices will remain in current assembly facility and piece part changes as follows:
Material
Current
Proposed
Wire (mils)
0.80, 0.96, 1.15mils Au
0.96mils Cu
Mount compound
4042500
4147858
Mold compound
4205694
4211880
Reason for Change:
Continuity of supply.
1) To align with world technology trends and assembly materials with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None.
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
Changes to product identification resulting from this PCN:
None.
Product Affected:
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