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CL10B104KB8NNWC 其他数据使用手册 - Samsung（三星）
制造商:
Samsung（三星）
分类:
电容
封装:
0603
描述:
MLCC-多层陶瓷电容器
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3D模型
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CL10B104KB8NNWC数据手册
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Kinetis KL03 32 KB Flash
48 MHz Cortex-M0+ Based Microcontroller
Supports ultra low power 48 MHz devices with up to 32 KB
Flash.
World's smallest MCU based on ARM
®
technology. Ideal
solution for Internet of Things edge nodes design with ultra small
form factor and ultra low power consumption. The products
offers:
• Tiny footprint packages, including 1.6 x 2.0 mm
2
WLCSP
• Run power consumption as low as 50 µA/MHz
• Static power consumption as low as 2.2 µA with 7.5 µs
wakeup time for full retention and lowest static mode down
to 77 nA in deep sleep
• Highly integrated peripherals, including new boot ROM and
high accurate internal voltage reference, etc
Core
• ARM
®
Cortex
®
-M0+ core up to 48 MHz
Memories
• Up to 32 KB program flash memory
• 2 KB SRAM
• 8 KB ROM with build-in bootloader
• 16 bytes regfile
System peripherals
• Nine low-power modes to provide power optimization
based on application requirements
• COP Software watchdog
• Low-leakage wakeup unit
• SWD debug interface and Micro Trace Buffer
• Bit Manipulation Engine
Clocks
• 48 MHz high accuracy internal reference clock
• 8/2 MHz low power internal reference clock
• 32 kHz to 40 kHz crystal oscillator
• 1 kHz LPO clock
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C for QFN
packages; -40 to 85°C for WLCSP packages
Human-machine interface
• General-purpose input/output up to 22
Communication interfaces
• One 8-bit SPI module
• One LPUART module
• One I2C module supporting up to 1 Mbit/s, with
double buffer
Analog Modules
• 12-bit SAR ADC with internal voltage reference, up
to 818 ksps and 7 channels
• High-speed analog comparator containing a 6-bit
DAC and programmable reference input
• 1.2 V voltage reference (Vref)
Timers
• Two 2-channel Timer/PWM modules
• One low-power timer
• Real time clock
Security and integrity modules
• 80-bit unique identification number per chip
MKL03ZxxVFG4
MKL03ZxxVFK4
MKL03Z32CAF4R
MKL03Z32CBF4R
16-pin QFN (FG)
3 x 3 x 0.65 Pitch 0.5
mm
24-pin QFN (FK)
4 x 4 x 0.65 Pitch 0.5
mm
20 WLCSP
2 x 1.61 x 0.56 Pitch 0.4 mm(AF) 2 x 1.61 x
0.32 Pitch 0.4 mm (BF)
NXP Semiconductors
Document Number: KL03P24M48SF0
Data Sheet: Technical Data Rev. 5.1 08/2017
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
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