Datasheet 搜索 > 电容 > Samsung（三星） > CL31B223KCCNFNC 数据手册 > CL31B223KCCNFNC 产品描述及参数 1/2 页
器件3D模型￥ 0.094
CL31B223KCCNFNC 产品描述及参数 - Samsung（三星）
制造商:
Samsung（三星）
分类:
电容
封装:
1206
描述:
MLCC-多层陶瓷电容器
Pictures:
3D模型
符号图
焊盘图
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CL31B223KCCNFNC数据手册
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SPECIFICATION
Supplier : Samsung electro-mechanics
Samsung P/N :
CL31B223KCCNFNC
Product : Multi-layer Ceramic Capacitor Description :
CAP, 22㎋, 100V, ±10%, X7R, 1206
CL
31 B 223 K C C N F N C
① ②③ ④ ⑤⑥⑦⑧⑨⑩⑪
① Series
Samsung Multi-layer Ceramic Capacitor
② Size
1206 (inch code) L: 3.2 ± 0.15 mm W: ± 0.15 mm
③ Dielectric
X7R
⑧ Inner electrode
④ Capacitance
22
㎋
Termination
⑤ Capacitance
±10 %
Plating
(Pb Free)
tolerance ⑨ Product
Product for POWER application
⑥ Rated Voltage
100 V
⑩ Special
Reserved for future use
⑦ Thickness
0.85 ± 0.15 mm
⑪ Packaging
Cardboard Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance
Within specified tolerance
1㎑±10%
1.0±0.2Vrms
Tan δ (DF)
0.025 max.
Insulation
10,000Mohm or 500Mohm㎌
Rated Voltage 60~120 sec.
Resistance
Whichever is Smaller
Appearance
No abnormal exterior appearance
Microscope (10)
Withstanding
No dielectric breakdown or of the rated voltage
Voltage
mechanical breakdown
Temperature
X7R
Characterisitcs
(From -55℃ to 125℃, Capacitance change shoud be within ±15%)
Adhesive Strength
No peeling shall be occur on the
500gF, for 10±1 sec.
of Termination
terminal electrode
Bending Strength
Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability
More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Capacitance change : within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Soldering heat
Tan
δ, IR : initial spec.
Sn 100%
Cu
Ni
A. Samsung Part Number
Performance Test condition
200%
1.6
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