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CSD16325Q5 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
8-VSON-CLIP
描述:
N 通道 NexFET™ 功率 MOSFET
Pictures:
3D模型
符号图
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CSD16325Q5数据手册
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of 3 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20140303000C
PCN Number:
20140303000C
PCN Date:
02/09/2015
Title:
Qualification of Amkor Philippines as Alternate Assembly/Test site for select PQFN
Devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
06/05/2014
Estimated Sample Availability:
03/05/2014
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Revision C is to announce the retraction of the CSD16401Q5. This affected device is identified
with a strikethrough and is highlighted in yellow in the Product Affected Section. The other
devices listed below with a strikethrough were retracted on Revision A and Revision B of
PCN201403003000.
Amkor Philippines is being qualified as an additional Assembly/Test site for the devices listed
below. There are no BOM differences between devices assembled at Amkor Philippines versus the
current Assembly site.
Reason for Change:
Continuity of Supply
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Assembly Site
PSi
Assembly Site Origin (22L)
ASO: PAC
Amkor Philippines
Assembly Site Origin (22L)
ASO: AP3
Sample product shipping label (not actual product label)
Topside Device marking:
Assembly site code for PAC= E
Assembly site code for AP3= 3
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