Datasheet 搜索 > MOS管 > TI（德州仪器） > CSD16325Q5C 数据手册 > CSD16325Q5C 其他数据使用手册 2/3 页
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CSD16325Q5C 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
VSON-Clip-8
描述:
DualCool™ N 通道 NexFET™ 功率 MOSFET
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
电气规格在P1
导航目录
CSD16325Q5C数据手册
Page:
of 3 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20140523000A
CSD16401Q5
CSD17309Q3
CSD18540Q5B
CSD87351ZQ5D
CSD16406Q3
CSD17311Q5
CSD19502Q5B
CSD87352Q5D
CSD16407Q5
CSD17312Q5
CSD19532Q5B
CSD87353Q5D
CSD16407Q5C
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 1 : CSD87331Q3D (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#200805
# Pins-Designator, Family:
8-DQZ, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 2 : CSD58869Q5D (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#202828
# Pins-Designator, Family:
8-DQY, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 3 : CSD16407Q5 (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#202828
# Pins-Designator, Family:
8-DQH, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
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