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CSD16556Q5B 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
VSON-Clip-8
描述:
25V NexFET N 通道功率 MosFET
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CSD16556Q5B数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20141218000
PCN Number:
20141218000
PCN Date:
12/19/2014
Title:
Qualification of Amkor Philippines and JCAP China as an Alternate Assembly and Test
site for Select Devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality
Services
Proposed 1
st
Ship Date:
03/19/2015
Estimated Sample Availability:
Provided upon
Request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of Amkor Philippines and JCAP China
as alternate Assembly and test sites for the devices listed below. The material set will remain the
same for the devices in Group 1b and 2. Group 1a BOM differences are noted below:
PSi
Clark
Amkor
Mold Compound
SID#202828
4208625
SID#202828
Lead Finish
Matte Sn
NiPdAu
Matte Sn
Current Assembly/Test Site
New Assembly/Test Site
Group 1B
PSi
Amkor
Current Probe/Backend Site
New Probe/Backend
Site
Group 2
TI Clark
JCAP China
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of Supply
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Assembly Site
PSI
Assembly Site Origin (22L)
ASO: PAC
TI Clark
Assembly Site Origin (22L)
ASO: QAB
Amkor Philippines
Assembly Site Origin (22L)
ASO: AP3
JCAP China
Assembly Site Origin (22L)
ASO: JCP
Sample product shipping label (not actual product label)
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