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CSD87331Q3D 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
LSON-CLIP-8
描述:
30V 同步降压 NexFET™ 电源块
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
电气规格在P3
导航目录
CSD87331Q3D数据手册
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Texas Instruments, Inc. PCN#20140523000
Qualification Data – Approved May, 2014
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Reference Qualification# 4 : CSD25401Q3 (MSL 1-260C)
Package Construction Details
Assembly Site:
PAC
Mold Compound:
SID#202828
# Pins-Designator, Family:
8-DQG, LSON-CLIP
Mount Solder:
SID#200757
Lead frame (Finish, Base):
Matte Sn, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size/Fail
**T/C -40C/125C
-40C/+125C (500 Cyc)
77/0
Notes **- Preconditioning sequence: Level 1-260C.
For questions regarding this notice, e-mails can be sent to the regional contacts shown below
or your local Field Sales Representative.
Location
E-Mail
USA
PCNAmericasContact@list.ti.com
Europe
PCNEuropeContact@list.ti.com
Asia Pacific
PCNAsiaContact@list.ti.com
Japan
PCNJapanContact@list.ti.com
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