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CSD87331Q3D 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
MOS管
封装:
LSON-CLIP-8
描述:
30V 同步降压 NexFET™ 电源块
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P13P14
原理图在P10
封装尺寸在P18P21P23P24
焊盘布局在P19
标记信息在P21
封装信息在P1P18P19P20P21P22P23P24
技术参数、封装参数在P3
应用领域在P1
电气规格在P4
导航目录
CSD87331Q3D数据手册
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2
CSD87331Q3D
SLPS283B –SEPTEMBER 2011–REVISED FEBRUARY 2017
www.ti.com
Product Folder Links: CSD87331Q3D
Submit Documentation Feedback Copyright © 2011–2017, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Specifications......................................................... 3
5.1 Absolute Maximum Ratings...................................... 3
5.2 Recommended Operating Conditions....................... 3
5.3 Power Block Performance ........................................ 3
5.4 Thermal Information.................................................. 3
5.5 Electrical Characteristics........................................... 4
5.6 Typical Power Block Device Characteristics............. 5
5.7 Typical Power Block MOSFET Characteristics......... 7
6 Application and Implementation ........................ 10
6.1 Application Information............................................ 10
6.2 Typical Application.................................................. 13
7 Layout................................................................... 15
7.1 Layout Guidelines ................................................... 15
7.2 Layout Example ...................................................... 16
8 Device and Documentation Support.................. 17
8.1 Documentation Support .......................................... 17
8.2 Receiving Notification of Documentation Updates.. 17
8.3 Community Resources............................................ 17
8.4 Trademarks............................................................. 17
8.5 Electrostatic Discharge Caution.............................. 17
8.6 Glossary.................................................................. 17
9 Mechanical, Packaging, and Orderable
Information........................................................... 18
9.1 Q3D Package Dimensions...................................... 18
9.2 Land Pattern Recommendation.............................. 19
9.3 Q3D Tape and Reel Information............................. 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2012) to Revision B Page
• Added note for I
DM
in the Absolute Maximum Ratings table .................................................................................................. 3
• Added Application and Implementation section note ........................................................................................................... 10
• Changed Recommended PCB Design Overview section to Layout section........................................................................ 15
• Added the Device and Documentation Support section....................................................................................................... 17
Changes from Original (September 2011) to Revision A Page
• Added Feature Bullet: Up to 15 A Operation. ........................................................................................................................ 1
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